Technology

Asia's AI Manufacturing Boom: Chips, HBM, Factories & Data Centres (2024–2030)

The AI boom is concentrating manufacturing investment, not lifting all of Asia evenly. Taiwan (TSMC) leads advanced logic chips and packaging; South Korea (SK…

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PMI CONFIRMS AI DEMAND

AI Demand Reaches Ordinary Factory Surveys

August 2026 PMI data shows AI/semiconductor demand supporting factory activity in Japan (54.9), Taiwan (54.7), South Korea (52.3) and China (51.5). India's PMI eased to…

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KOREA'S EXPORT SURGE

Korea's Chip Exports Jump, AI-Server Forecast Raised

South Korea's exports jumped 68.7% year-on-year to $98.25bn, with semiconductor exports specifically up 209% to $46.65bn. TrendForce separately raised its 2026 global AI…

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TSMC RAISES CAPEX

TSMC Raises 2026 Capex to $60–64bn; China Reports IC Output

TSMC's Q2 2026 earnings call raised full-year capex guidance from $52-56bn to $60-64bn, citing sustained AI/HPC demand. China's official statistics showed 279.8 billion…

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MEMORY WARNING

SK Hynix Warns Memory Shortage Could Last to 2030

SK Group chairman Chey Tae-won said the AI-driven memory shortage could run until 2030, pledging to double memory wafer capacity within five years. This is a company for…

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INDIA'S FIRST PRODUCTION

India's Semiconductor Build-Out Reaches First Commercial Production

Kaynes Semicon became fully operational 31 March 2026, joining CG Semi and Micron's Sanand facility as India's first commercially producing OSAT/assembly units. Tata Ele…

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JOHOR TIGHTENS RULES

Johor's Data-Centre Pipeline Tightens Power/Water Approvals

Malaysia's PM confirmed non-AI data-centre approvals had already been restricted over electricity and water demand; a Johor committee began rejecting applications requir…

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CAPACITY CATCHES UP

Factory Capacity Begins Catching Up to 2024's Shortage

HBM and advanced-packaging expansion accelerated across Korea and Taiwan; India and Malaysia's semiconductor and data-centre construction moved from announcement to grou…

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THE BOOM BEGINS

AI Infrastructure Moves From Experiment to Spending Boom

GPU and HBM shortages, CoWoS packaging constraints and rapidly rising hyperscaler capex defined 2024 as the year AI infrastructure spending became a macro-visible trend,…

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WATCHPOINTS

Future Watchpoints - Forecasts and Plans, Not Confirmed Outcomes

Rapidus targets 2nm-class production in H2 FY2027; Tata's Dholera fab targets 2028. SK Hynix sees the memory shortage possibly persisting beyond 2030. HBM4E, silicon pho…

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